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D2W is a professional hunting firm focusing on high tech industries such as semi-conductor, new energy, IC design house, consumer electronics, startup companies of AI solutions, Cloud services, Fintech, e-commerce and related territories.
The Semiconductor Packaging Engineering Manager will report to Director of Packaging and is responsible for NPI planning across R and D and OPS, Production Sustaining, and qualification of unique custom packaging technology for company’s revolutionary MEMS-based timing products.
Responsibilities include managing and leading a team of engineers in Taiwan for packaging materials research and development, process development and optimization, package qualification, release-to production, and production sustaining. In addition, he/she will be responsible for managing local and
overseas vendors in new package development activities including DoEs (Design-of-Experiments).
The Semiconductor Package Engineering manager will have a highly visible role within the company, working cross-functionally to ensure system-level performance of company’s ultra-stable timing products.
The Probe Engineer is responsible for sustaining probing activities including capacity expansion, yield enhancement, process advancement, quality improvement and cost reduction activities. The Probe Engineer will work closely with the worldwide Operations and Systems team to develop and deploy production test solutions.
• Plan and execute device verification and characterization
• Characterize and bring into production mixed-signal timing devices incorporating MEMS resonators
• Support the bring-up of specialized programming systems
• MS or PhD in Electrical or Mechanical Engineering. Exceptional candidates with other backgrounds will be considered
