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Packaging Engineering Sr Engineer

Packaging Engineering Sr Engineer

The Semiconductor Packaging Engineering Sr Engineer will report to Director of Packaging and is responsible for NPI planning across RD and OPS, Production Sustaining, and qualification of unique custom packaging technology for biz’s revolutionary MEMS-based timing products. Responsibilities packaging materials research and development, process development and optimization, package qualification, release-to-production, and production sustaining. In addition, he/she will be responsible for managing local and overseas vendors in new package development activities including DoEs (Design-of-Experiments).
DETAIL
Responsibilities:
1) Function as NPI planner for Packaging RD and OPS.
2) Help train engineers with Build plans and risk analysis.
3) Implements PLC business processes across projects owned by Taiwan team.
4) Work with OSATs to design and develop semiconductor packages incorporating MEMS components.
5) New package qualification and release-to-production activities.

Requirements:
1) BS or MS in Mechanical Engineering, Material Science, or equivalent.
2) 8+ Years in Packaging Engineering of experience working with OSATs to bring new IC packages to production.
3) Very good communication skills to be able to work with work wide cross functional teams